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International collaboration EU and Japan on semiconductors

Digital Europe Programme · DIGITAL-JU-CHIPS-2026-SG-JAPAN

Grants for EU-Japan semiconductor projects on advanced 2.5D/3D packaging, integrated photonics and standard chiplet interfaces.

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What is this call about?

The topic funds EU-Japan collaboration on advanced heterogeneous integration, including 2.5D and 3D packaging and integrated photonics for AI, and on standardised chiplet interfaces. Work should be validated in laboratory and pilot settings with semiconductor manufacturing use cases.

What does this call fund?

The topic supports collaboration between the EU and Japan on semiconductor technologies, with a focus on advanced integration and chiplet interoperability.

Expected outcomes

  • Advanced heterogeneous integration, in particular 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
  • Standardised chiplet interfaces that enable interoperability and foster a dynamic chiplet ecosystem.
  • Outcomes should have a direct and immediate impact on European industry.

Scope of the work

Projects should demonstrate solutions in both laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of the work should be at Technology Readiness Levels 5 to 7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications and networking events.

Type of action and funding

The topic is implemented as a simple grant. The EU contribution per project ranges from €3,000,000 to €5,000,000, and two projects are expected to be funded.

What are the key facts?

Topic budget
€5,000,000
Minimum amount per project
€3,000,000
Maximum amount per project
€5,000,000
Call code
DIGITAL-JU-CHIPS-2026-SG-JAPAN
Programme
Digital Europe Programme
Expected number of projects
2

Who can apply for this call?

  • The call text sets no conditions of its own on who can apply; the general eligibility conditions of the programme apply.

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When is the deadline?

8 December 2026 (33 days)

24 September 2026 (single-stage call).

Interested in this call? Summary written with AI from the official call documents. Details can differ, so check the official call page before you apply. Read the official call documents before you decide. The official text is always binding.

Official call page ↗

Source: EU Funding & Tenders Portal and the official call documents. Official call page Last updated 15 October 2026.