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UPC GreenChips-EDU Scholarship for international mobility in the Master's Degree in Electronic Engineering

Digital Europe Programme · DIGITAL-2022-SKILLS-03-SPECIALISED-EDU

Grants of up to €10,000 for UPC electronic engineering master's students on mobility to GreenChips-EDU partner institutions.

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What is this call about?

The call funds tuition, documentation, training, publication and living costs linked to international mobility within the GreenChips-EDU network. It is aimed at students admitted to, or applying for, the UPC Master's Degree in Electronic Engineering.

What does this call fund?

Scope

UPC offers grants to students of the Master's Degree in Electronic Engineering (MEE) at its Barcelona School of Telecommunications Engineering (ETSETB). The grants support academic training in electronics that involves mobility to one of the foreign institutions in the GreenChips-EDU project, covering double degree programmes and short-term stays.

Grant blocks

  • Tuition and registration fees: up to €3,500 per beneficiary, for semesters starting before 30 June 2027.
  • Documentation costs such as visas, insurance, language accreditation and sworn translations: up to €1,000.
  • Specialised training courses related to GreenChips-EDU during a mobility stay: up to €1,500.
  • Scientific achievements during mobility: up to €1,000 for open-access publication in first or second quartile journals, €500 in third or fourth quartile journals, €100 for posters, and €1,500 for attending an international CORE B or higher congress (€2,000 for CORE A*).
  • Short-term stays of less than two months not covered by Erasmus+: up to €1,500 for transport, accommodation and meals.
  • Long-term stays of more than two months: €500 per month for up to 12 months, with a maximum of €6,000, not overlapping with other grants for the same purpose.

A student may combine blocks but can receive at most €10,000 in total.

Application modalities

  • Double degree modality: for students in an MEE double degree programme with a GreenChips-EDU partner; all blocks except short-term stays; priority over the other modality.
  • International mobility modality: for students granted a mobility place at a partner institution; all blocks, with tuition covered for up to two consecutive semesters.

Selection

A selection committee from the MEE Academic Committee scores applications out of 35 points: academic performance (20), additional academic merits (5), professional experience (5), female applicants (2), socioeconomic vulnerability (2) and motivation (1).

What are the key facts?

Topic budget
€40,000
Maximum amount per project
€10,000
Call code
DIGITAL-2022-SKILLS-03-SPECIALISED-EDU
Programme
Digital Europe Programme
Funder
UPC, within the GreenChips-EDU project
Eligible applicants
students admitted to or applying for the UPC Master's Degree in Electronic Engineering

Who can apply for this call?

  • Individual students admitted to the MEE master's degree at ETSETB, or who have applied for admission for the 2025/2026 academic year or later.
  • Applicants must be citizens of the EU, Iceland, Norway, Liechtenstein or Ukraine.
  • At the time of application, applicants must be enrolled in a programme in electronic engineering or a similar field at a higher education institution in the EU, Iceland, Norway, Liechtenstein or Ukraine.
  • For the double degree modality, applicants must hold a place in the MEE double degree programme or have the endorsement of the Head of Studies of the MEE and the Deputy Director of International Relations of ETSETB.

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When is the deadline?

Applications can be submitted from the day after publication until the budget is exhausted and in any case until 1 June 2027. The cut-off dates are 7 September 2025, 15 February 2026, 1 July 2026, 15 September 2026, 14 February 2027 and 1 June 2027.

Interested in this call? Summary written with AI from the official call documents. Details can differ, so check the official call page before you apply. Read the official call documents before you decide. The official text is always binding.

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Source: the official call page and the official call documents. Always check them before you apply. Official call page Last updated 16 October 2026.