Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) (Photonics Partnership)

Worum geht es in dieser Ausschreibung?

The call funds research and innovation actions that develop integrated photonic devices and circuits with better performance and ultra-low power consumption for digital, automotive, industrial, health and security uses.

Was fördert diese Ausschreibung?

Scope

Research and innovation should improve the functionality, efficiency and integration of photonic devices and circuits, with a focus on system performance. Each action should address at least two of the following:

• Better spectral purity, wavelength coverage, output power and noise characteristics
• Faster modulation or detection beyond current photonic integrated circuit platforms, better signal processing, and integration of new materials such as thin-film lithium niobate, BTO, graphene, silicon carbide, phase change materials and TMDCs
• Miniaturised, high-complexity photonic circuits, scalable interconnects and electronics-photonics integration
• Lower power consumption, for example through better electrical-to-optical conversion, lower optical losses, higher operating temperatures and low-power control

Expected outcomes

Advanced integrated photonic devices for sectors such as digital, automotive, industrial, health and security; stronger competitiveness of EU photonics actors; better electro-optic systems in communication, computing, sensing, medical diagnostics and AI; and low-power sensors with higher performance.

Other conditions

Proposals should consider system-level impact and demonstrate progress in representative configurations for one or more application domains. Work is expected to start at TRL 3 and reach TRL 6. The topic implements the co-programmed European Partnership on photonics.

Wann endet die Einreichungsfrist?

18. März 2027 (132 Tage)

18 March 2027. Single-stage submission; planned opening date 17 November 2026.