Advanced and Innovative hardware components for Virtual Worlds (RIA) (Virtual Worlds Partnership)

Quel est l’objet de cet appel ?

The call funds research and innovation actions developing advanced hardware for immersive virtual worlds, such as XR headsets, haptics, sensors and brain-computer interfaces. Consortia must include social sciences and humanities expertise.

Que finance cet appel ?

Scope

The topic supports research into the next generation of XR hardware for virtual worlds: headsets, screens, wearables, haptic components, sensors and actuators, advanced chips and non-invasive brain-computer interfaces for hands-free interaction. The aim is deeper, closer-to-reality immersion that stimulates all senses (sight, hearing, feel, touch and smell).

What proposals should do

• Investigate new scientific approaches, or push existing ones further, to improve synchronisation and integration of different sensory modalities
• Integrate components into fully tested devices and demonstrate them in industrial and societal scenarios
• Focus on performant, reliable, miniaturised and interoperable technologies, with inclusivity and energy efficiency at the centre
• Build on existing open standards and contribute to ongoing standardisation work

Expected outcomes

Innovative and advanced XR hardware, headsets, screens, wearables, haptic components, sensors, actuators and chips for more realistic immersion.

Other conditions

The topic requires an effective contribution from social sciences and humanities (SSH) experts and institutions. Work is expected to start at TRL 3 and reach TRL 5. Beneficiaries must notify the granting authority before transferring ownership of results or granting an exclusive licence; the authority may object for up to four years after the action ends. The topic implements the co-programmed European Partnership on Virtual Worlds.

Quelle est la date limite ?

18 mars 2027 (133 jours)

18 March 2027. Single-stage submission; planned opening date 17 November 2026.